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TCSF200 - Silicone-Free Thermal Conductive Pad

Product Presentation

Silicone-Free Thermal Conductive Pad, Professional Thermal Management Solutions


Main Features:

◇ 2.00 W/mk  thermal conductivity 
◇ Silicone-Free Thermal Pad
◇ Naturally tacky for easy application
◇ Electrically insulating


 

Typical Applications Include:
 

◇ Network Equipement, Mass Storage devices
◇ Industrial Automation, Telecom Device.
◇ Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.


Typical Properties of TCSF200 Silicone-Free Thermal Pad
Properties Units TCSF200 Test Method
Composition --- Acrylic ---
Color --- Grey Visual
Thickness mm 0.5 to 5 ---
Thickness Tolerance   +/-0.02mm ---
Heat Capacity(1/g-K) (1/g-K) 1.1 ASTM E1269
Outgassing TML --- 0.12% ASTM E595
Outgassing CVCM --- 0.06% ASTM E595
Hardness (Shore 00) 60 ASTM D2240
Density(g/cm) --- 3.13 ASTM D792
Continuous Use Temp -60 to 200 EN344
ELECTRICAL  
Dielectric Breakdown Voltage (Vac) ≥200 Vac/mil ASTM D149
Volume Impedance (ohm-cm) <500 ASTM D257
Flame Rating   V 0 UL 94
THERMAL  
Thermal Conductivity W/m.k 2.0 ASTM D5470

 

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