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Selection Guide for Choose Thermal Interface Materials Products

Efficient thermal transfer depends directly on the ability of thermal interface materials to fill in all interfacial voids and avoid creating internal voids of their own. Selection guide for choose right thermal interface materials Products.

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Location：HOME > THERMAL PRODUCTS > Thermal Grease > Thermal Grease

Thermal Conductive Grease/Thermal Interface Material

Product Presentation


Features:

 

 

3.0 W/mk Thermal Conductivity,Good Thixotropism
Soft and ultra high compressibility for low stress applications
Higher viscosity compound than grease, it eliminates the bleed,
separation,pump-out & dirtly other parts usually associated with grease

 

Applications:

 

 

Smart TV stick/USB, Dongle
Automotive engine control, Graphices Cards, Telecom device.
Ideal applications for various mechnical gap tolerances for different heating-generation componment on the PCB
Be used by screen print,syringe,high volume of automated dispense

 

 

TYPICAL PROPERTIES OF TCP300G
PROPERTY METRIC VALUE TEST METHOD
Color  White or Light Blue Visual
Min. BondlineThickness (mm) 0.10 ----
Flow Rate (G/min) 8~10 ----
Viscosity(@0.5rpm)  4,000,000 ASTM D2240
Density (g/cc) 2.88 ASTM D792
Deflection at 5 PSI 70% ----
Outgassing TML 0.10% ASTM E595
Outgassing CVCM 0.27% ASTM E595
Continuous Use Temp (℃) -60 to 200 EN344
ELECTRICAL  
Breakdown Voltage(Kv/mm) NA ASTM D149
Volume Impedance (ohm-cm) 1 x1013 ASTM D257
Flame Rating V0 UL 94
THERMAL  
Thermal Conductivity (W/m.k)  3.0 ASTM D5470
Thermal Impedance at 10 psi (℃-in2/W))  0.045 ASTM D5470

 

 

Configurations Available:

30cc, 50cc, 100ccm, 300cc

 

Product Photos:

 

 

 

 

 

INSTANT TURNKEY QUOTE

 

Last：Good Thixotropism Thermal Conductive Putty/Gel
Next：TCG150 Thermal Conductive Grease/Paste
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