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Thermal Insulating Pad Selection Guide (0.2W/m.k)

Features and Benefits:


Thermal Conductivity: 0.20W/m.k
High compressible closed-cell silicone foam
Thermal insulating and low compressure Set   
Typical Properties of Thermal Insulating Pad Materials
Properties Units TCP20 Series Test Method
Material --- Silicone Foam ---
Color --- Gray Visual
Cellular structure --- Closed ---
Density g/cm3 0.25 ~ 0.8(+/-0.1) ASTM D792
Hardness Shore C 20~45 (+/-5) ASTM-D2240
Tensile Strength 'Mpa ≥0.4 ASTM D412
Elongation % ≥200 ASTM D412
ELECTRICAL  
Volume Resistivity Ω.cm 1.5×1015 ASTM D149
Dielectric Strength KV/mm ≥15 ASTM-D149
Flame Rating   V 0 UL 94
THERMAL  
Thermal Conductivity W/m.k 0.2 ASTM D5470

Note: "D" suffix: one side tacky and non-tacky on the other side 
      "A1" suffix: Additional adhesive on one side, "A2" suffix: Additional adhesive on both sides
      "M" suffix: Fiberglass reinforcement in the middle layer for all the size if required
      "F" suffix: Fiberglass reinforcement on top or bottom layer
      Standard sheet: 200x400mm, 300x300mm, Custom configuration Available

Premium Thermally Conductive Pad Selection Guide (35,50W/m.k)

Features and Benefits:

◇ 35 and 50 W/mk Outstanding Thermal Conductivity
◇ Carbon Fiber Filled,High Stability and Suitable For Extreme Enviroment
◇ Non- tacky and good rebound for easy applicaiton

Typical Properties of Premium Thermal Pads
Properties Units AL20 AL50 Test Method
Construction & Composition --- Carbon Loaded Silicone Carbon Loaded Silicone ---
Color --- Black Black Visual
Thickness mm 0.50 to 3.0 0.30 to 3.0 ---
Thickness Tolerance   +/-0.02mm +/-0.02mm ---
Hardness (Shore 00) 20 50 ASTM D2240
Density(g/cm) --- 2.4 2.4 ASTM D792
Continuous Use Temp  200 EN344
Breakdown Voltage (AC kV/mm) <0.1 <0.1 ASTM D149
Withstand Voltage (AC kV/mm) <0.1 <0.1 ASTM D149
Volume Impedance (ohm-cm) <500 <500 ASTM D257
Flame Rating   V 0 V 0 UL 94
Specific Heat Capacity --- 0.87 J/g-k 0.87 J/g-k ASTM D5470
Thermal Mass --- 2088 kj/m3-k 2088 kj/m3-k ASTM D5470
Thermal Conductivity W/m.k 35 50 ASTM D5470 
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    Widely Used Thermal Conductive Pad Selection Guide (1.0~7.5 /m.k)

    Features and Benefits:

    ◇All thermal conductive pad/gap pad are used to fill in air gaps between heat-generating electronic component and heatsinks,metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high compliance.

    ◇All our thermal pad series materials is very cost-effective materials which is made through advanced manufacturing process and with meeting the requirement of UL 94 V0 , RoHs and Reach compliance.

    Typical Application

    - Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
    - ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
    - Cooling or thermal Module, in all applications where a metal housing is used as heatsink.

    Typical Properties of 1.0-7.5W/m.k Thermal Pad/SheetTypical Properties of  1.0-7.5W/m.k Thermal Gap Pad
    Properties Units TCP100 TCP150 TCP200 TCP300 TCP500 TCP600 TCP750 TCP110U
    Color --- Gray Black Dark Gray Blue Pink~Violet Light Blue Violet pink/white
    Reinforcement Carrier --- --- --- --- --- --- --- --- Fiberglass
    Thickness Range mm 0.25~15 0.25~15 0.25~15 0.25~15 0.25~15 0.3~10 1.0~10 0.5~10
    natural tacky 2 2 2 2 2 2 2 2 1
    Hardness Shore C 25,35 15,25,35 15,25,35 25,35 30 30 50 5, 15
    Density g/cc 1.8 2.2 2.4 2.6 3 3.6 3.8 2.0
    Continuous Use Temp -40 to 200
    ELECTRICAL  
    Breakdown Voltage Kv/mm ≥9 ≥9 ≥9 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0
    Volume Impedance ohm-cm ≥4x1012 ≥5x1012 ≥3.6x1013 ≥1.1X1014 ≥1.1X10 14 ≥6.5X1010 ≥6.5x1010 ≥6.2X1015
    Dielectric Constant 1MHz 5.27 5.2 6 6.8 6.6 6.5 6.8 5.5
    Flame Rating --- V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
    THERMAL  
    Thermal Conductivity W/m.k 1.0 1.5 2.0 3.0 5.0 6.0 7.5 1.1



Contact SinoGuide for Thermal Gap Pads/Sheets, Thermal Pads, Thermal Interface Pads

Contact Us for further assistance with thermal pads, including thermal gap filler pads, thermally insulating foam, heat conductive pads, thermal conductive pads, and thermal interface pads.

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