Full Range Of Thermal Conductive Pad

Thermal Insulating Pad Selection Guide (0.2W/m.k)

Typical Properties of Thermal Insulating Pad Materials
Properties	Units	TCP20 Series		Test Method
Material	---	Silicone Foam		---
Color	---	Gray		Visual
Cellular structure	---	Closed		---
Density	g/cm3	0.25 ~ 0.8(+/-0.1)		ASTM D792
Hardness	Shore C	20~45 (+/-5)		ASTM-D2240
Tensile Strength	'Mpa	≥0.4		ASTM D412
Elongation	%	≥200		ASTM D412
ELECTRICAL
Volume Resistivity	Ω.cm	1.5×1015		ASTM D149
Dielectric Strength	KV/mm	≥15		ASTM-D149
Flame Rating		V 0		UL 94
THERMAL
Thermal Conductivity	W/m.k	0.2		ASTM D5470

Note: "D" suffix: one side tacky and non-tacky on the other side 
      "A1" suffix: Additional adhesive on one side, "A2" suffix: Additional adhesive on both sides
      "M" suffix: Fiberglass reinforcement in the middle layer for all the size if required
      "F" suffix: Fiberglass reinforcement on top or bottom layer
      Standard sheet: 200x400mm, 300x300mm, Custom configuration Available

Premium Thermal Conductive Pad Selection Guide (35,50W/m.k)

Features and Benefits:

Typical Properties of Premium Thermal Pad
Properties	Units	AL20		AL50		Test Method
Construction & Composition	---	Carbon Loaded Silicone		Carbon Loaded Silicone		---
Color	---	Black		Black		Visual
Thickness	mm	0.50 to 3.0		0.30 to 3.0		---
Thickness Tolerance		+/-0.02mm		+/-0.02mm		---
Hardness	(Shore 00)	20		50		ASTM D2240
Density(g/cm)	---	2.4		2.4		ASTM D792
Continuous Use Temp	℃	200				EN344
Breakdown Voltage	(AC kV/mm)	<0.1		<0.1		ASTM D149
Withstand Voltage	(AC kV/mm)	<0.1		<0.1		ASTM D149
Volume Impedance	(ohm-cm)	<500		<500		ASTM D257
Flame Rating		V 0		V 0		UL 94
Specific Heat Capacity	---	0.87 J/g-k		0.87 J/g-k		ASTM D5470
Thermal Mass	---	2088 kj/m3-k		2088 kj/m3-k		ASTM D5470
Thermal Conductivity	W/m.k	35		50		ASTM D5470

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Widely Used Thermal Conductive Pad Selection Guide (1.0~7.5 /m.k)

Features and Benefits:

◇All thermal conductive pad/gap pad are used to fill in air gaps between heat-generating electronic component and heatsinks,metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high compliance.

◇All our thermal pad series materials is very cost-effective materials which is made through advanced manufacturing process and with meeting the requirement of UL 94 V0 , RoHs and Reach compliance.

Typical Application

- Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
- ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
- Cooling or thermal Module, in all applications where a metal housing is used as heatsink.


Typical Properties of  1.0-7.5W/m.k Thermal Gap Pad
Properties	Units	TCP100	TCP150	TCP200	TCP300	TCP500	TCP600	TCP750	TCP110U
Color	---	Gray	Black	Dark Gray	Blue	Pink~Violet	Light Blue	Violet	pink/white
Reinforcement Carrier	---	---	---	---	---	---	---	---	Fiberglass
Thickness Range	mm	0.25~15	0.25~15	0.25~15	0.25~15	0.25~15	0.3~10	1.0~10	0.5~10
natural tacky	2	2	2	2	2	2	2	2	1
Hardness	Shore C	25,35	15,25,35	15,25,35	25,35	30	30	50	5, 15
Density	g/cc	1.8	2.2	2.4	2.6	3	3.6	3.8	2.0
Continuous Use Temp	℃	-40 to 200
ELECTRICAL
Breakdown Voltage	Kv/mm	≥9	≥9	≥9	≥6.0	≥6.0	≥6.0	≥6.0	≥6.0
Volume Impedance	ohm-cm	≥4x1012	≥5x1012	≥3.6x1013	≥1.1X1014	≥1.1X10 14	≥6.5X1010	≥6.5x1010	≥6.2X1015
Dielectric Constant	1MHz	5.27	5.2	6	6.8	6.6	6.5	6.8	5.5
Flame Rating	---	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
THERMAL
Thermal Conductivity	W/m.k	1.0	1.5	2.0	3.0	5.0	6.0	7.5	1.1