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Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer
Cooling Module, Thermal module for Special application
Provides Ultra Low Outgassing characteristics for Aerospace and Electronics applications
Typical Properties of TCP110U Silicone Thermal Pad | |||||||
Properties | Units | TCP110U | Test Method | ||||
Material | --- | Silicone/Fiberglass | --- | ||||
Color | --- | Pink/white | Visual | ||||
Thickness Range | mm | 0.5~10 | --- | ||||
Natural tacky (1- or 2-sided) | g/cm3 | 1 | --- | ||||
Hardness | Shore C | 5,15 | ASTM E1269 | ||||
Density | g/cc | 2.2 | ASTM E595 | ||||
Continuous Use Temp | ℃ | -60 to 200 | EN344 | ||||
ELECTRICAL | |||||||
Breakdown Voltage(1mmT) | Kv/ac | ≥6 | ASTM D149 | ||||
Volume Impedance | (ohm-cm) | ≥6.2x1015 | ASTM D257 | ||||
Dielectric Constant | 1MHz | 5.5 | ASTM D150 | ||||
Flame Rating | V 0 | UL 94 | |||||
THERMAL | |||||||
Thermal Conductivity | W/m.k | 1.1 | ASTM D5470 |
Standard Sheet and Roll Sizes:
Sheet size: 200mmx400mm,300mm x 300mm,individual parts available. Roll Form available(300mm width)
Suffix: Different Options For thermal Pad as below
“A1” suffix: One side additional adhesive such as 3M 467, 3M9448
“NA” suffix: Natural tacky
Check List of Reliability Test Report for TCP110U is available after your request
Thermal gap pads remove heat in computers, tablets & electronic applications. Our thermal interface pads are available for a wide range of gap sizes. SinoGuide wide range of thermally conductive pads are designed to provide a heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
Learn More: Lowest Oil-leaking Thermal Gap Pad for Diminishing Potential
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