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TCP100 - Thermal Conductive Pad/Cooling Soft Gap Pad

Improves heat transfer between a CPU/chipset and heatsink with easy-to-use SinoGuide brand thermal pads.

Products Features:

1.00 W/mk thermal conductivity
Low Hardness
Cost-effective which is made through advanced manufacturing process
Electrically insulating

Typical Applications Include:


Bonding bus bars in a variety of electronic modules and sub-assemblies
Attaching a metal-based component to a heat sink
Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages
Bonding flexible circuits to a rigid heat spreader or thermal plane
Assembly tapes for BGA heat spreader
Attaching PCB assemblies to housings


Typical Properties of This Materials:

TCP100 Thermal resistance vs pressure

Typical Properties of Thermal Pad TCP100 Materials
Properties Units TCP100 Test Method
Material --- Silicone ---
Color --- Gray Visual
Thickness Range mm 0.25 to 15 ---
Natural tacky (1- or 2-sided) g/cm3 2 ---
Hardness Shore C 25,35 ASTM E1269
Density g/cc 1.8 ASTM E595
Continuous Use Temp -40 to 200 EN344
Breakdown Voltage(1mmT) Kv/ac ≥9 ASTM D149
Volume Impedance (ohm-cm) ≥4x1012 ASTM D257
Dielectric Constant 1MHz 5.27 ASTM D150
Flame Rating   V 0 UL 94
Thermal Conductivity W/m.k 1.0 ASTM D5470


Configurations Available:

Standard Sheet and Roll Sizes:

Sheet size:200 x 400mm, 350x350mm , individual parts available Roll Form available(300mm width)


Part No. Code:



Suffix: Different Options For thermal Pad as below


"A1" suffix: One side additional adhesive such as 3M 467, 3M9448

"A2" suffix: Two sides additional adhesive such as 3M 467, 3M9448

"NA" suffix: Natural tacky

"D" suffix: one side tacky and non-tacky on the other side

"M" suffix: Fiberglass reinforcement in the middle layer

"F" suffix: Fiberglass reinforcement on top or bottom layer



Low thermal conductivity thermal pad, Economical, Electrically Insulating, Soft Tack Elastomeric Material






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