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TCP600 High Heat Conductivity Thermal Gap Filler Pad/Cooling


Products Features:

6.00 W/mk High Thermal Conductivity
Low Thermal Resistance at Low Pressure
Naturally tacky for easy application
TCP600 Thermal Gap Filler Pad/Heat Transfer Pad

Typical Applications Include:


--Between heat-generation Component and heatsink.
--Automotive engine control, Graphices Cards, Telecom device.
--Wireless Hub,Military equipment, power supply.
--Cooling Module, Thermal module.
--Telecommunication Hardware


Typical Properties of This Materials:


Typical Properties of TCP600 Silicone Thermal Pad
Properties Units TCP600 Test Method
Material --- Silicone ---
Color --- Light Green Visual
Thickness Range mm 0.3~15 ---
Natural tacky (1- or 2-sided) g/cm3 2 ---
Hardness Shore C 30 ASTM-D2240
Density g/cc 3.7(+/-0.1) ASTM D792
Continuous Use Temp -60 to 200 EN344
Breakdown Voltage(1mmT) Kv/ac ≥6 ASTM D149
Volume Impedance (ohm-cm) ≥6.5x1010 ASTM D257
Dielectric Constant 1MHz 6.8 ASTM D150
Flame Rating   V 0 UL 94
Thermal Conductivity W/m.k 6.0 ASTM D5470


Configurations Available:

Sheet size:200 x 400mm, 350x350mm , individual parts available


Part No. Code:



Suffix: Different Options For thermal Pad as below


"A1" suffix: One side additional adhesive such as 3M 467, 3M9448

"A2" suffix: Two sides additional adhesive such as 3M 467, 3M9448

"NA" suffix: Natural tacky

"D" suffix: one side tacky and non-tacky on the other side

"M" suffix: Fiberglass reinforcement in the middle layer

"F" suffix: Fiberglass reinforcement on top or bottom layer


Check List of Reliability Test Report for TCP600 is available after your request




Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.







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