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Phase-change interface materials are characterized by the material's change from solid to soft aggregate state at a pre-defined temperature - the so-called phase-change temperature. Phase change materials (PCM) are solid films at room temperature that melt or soften when the temperature rises to 40-70°C. PCM's are composed of a mixture of wax-like binders, fine particles of ceramic fillers, and, optionally, a supporting substrate, such as aluminum foil or a woven glass mesh. When phase change occurs, the liquid-like materials fill the voids on the surfaces and reduce the thermal resistance. When the temperature drops, the materials maintain their shapes and form a solid joint between the two surfaces.
--Micro Processor Unit, Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
--Led Lighting, LCD TV, Telecom device, Graphic Processor Unit
--Computer peripherals for CPU, Memory modules, Power Semiconductors
--Military Electronics, Digital/High Power CPU's
Typical Properties of Thermal Conductive Phase Change Materials | |||||||
Properties | Units | TCPC120 | TCP300-PC | Test Method | |||
Construction & Composition | --- | Boron Nitride filled silicone elastomer | Boron Nitride filled silicone elastomer | --- | |||
Color | --- | Pink/Yelow | Grey | Visual | |||
Thickness | mm | 0.127/0.25 | 0.12-0.5 | ASTM D374 | |||
Thickness Tolerance | mm | +/-0.05mm | +/-0.05mm | --- | |||
Density | (g/cm) | 1.65 | 2.3 | ASTM D792 | |||
Temperature Range | ℃ | -40 to 130 | EN344 | ||||
Phase Change Temp | ℃ | 50~70 | 45~60 | --- | |||
ELECTRICAL | |||||||
Dielectric Constant | 1MHZ | 13.1 | 3.2 | ASTM D150 | |||
Volume Impedance | ohm-cm | 1.0*1013 | 1.0*1013 | ASTM D257 | |||
Flame Rating | --- | In compliance with V0 | In compliance with V0 | UL94 | |||
THERMAL | |||||||
Thermal Conductivity | W/m.k | 1.2 | 3.0 | ASTM D5470 |
Configurations Available:
Standard sheet: 460mm x 460mm , Custom configuration Available
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