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Full Range Of Silicone-Free Thermal Conductive Pad

 

Products Features:


Non-silicone Thermal Conductive Pad


3.0 &5.0W/m.k high thermal conductivity
Silicone-Free Thermal Pad, Acrylic Gap Filler & no oil bleeding issue
Naturally tacky for easy applicaiton
Electrically insulating

Silicone-Free Thermal Pad

 

 

Typical Applications Include:

 

--Between heat-generation Conponment and heatsink.
--Network Equipement, Mass Storage devices, Automotive engine control, Graphices Cards, Telecom device.
--Industrial Automation, Telecom Device,Telecommunication Hardware
--Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.
--Optical devices, Surveillance cameras.
 

Typical Properties of This Materials:

 

Typical Properties of Acrylic Silicone-Free Thermal Pads
Properties Units TCP300SF TCP500SF Test Method
Color --- Light Grey Dark Grey Visual
Thickness mm 1.0-3.0 1.0-3.0 ---
Thickness Tolerance   +/-0.02mm +/-0.02mm ---
Hardness (Shore 00) 45 60 ASTM D2240
Density(g/cm) --- 2.92 3.3 ASTM D792
Tensile Strength (Psi) 6.5 5.2 ASTM D412
Elongation (%) 13% 10% ASTM D412
Percent Deflection @ 2mm, 20psi 18% 14% ASTM D575
Continuous Use Temp (℃) -40 to 125 -40 to 125 EN344
ELECTRICAL  
Breakdown Voltage (VAC/mil) ≥180 ≥180 ASTM D149
Dielectric Constant (1MHz) 12.6 50 ASTM D150
Volume Impedance (ohm-cm) 1.0 x1013 1.0 x1013 ASTM D257
THERMAL  
Thermal Conductivity W/m.k 3.0 5.0 ASTM D5470

 

 

Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available

 

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

 

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