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Full Range Of Silicone-Free Thermal Conductive Pad

 

Products Features:


2.00 W/mk thermal conductivity
Silicone-Free Thermal Pad
Naturally tacky for easy applicaiton
Electrically insulating
Silicone-Free Thermal Pad

 

 

Typical Applications Include:

 

--Network Equipement, Mass Storage devices
--Industrial Automation, Telecom Device
--Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.
 

Typical Properties of This Materials:

 

Typical Properties of TCSF200 Silicone-Free Thermal Conductive Pad
Properties Units TCSF200 Series Test Method
Material --- Acrylic ---
Color --- Grey Visual
Thickness mm 0.5 to 5 ---
Hardness Shore 00 60 ASTM D2240
Density g/cc 3.13 ASTM D792
Heat Capacity 1/g-K 1.1 ASTM E1269
Outgassing TML --- 0.12% ASTM E595
Outgassing CVCM --- 0.06% ASTM E595
Continuous Use Temp -60 to 200 EN344
ELECTRICAL  
Dielectric Breakdown Voltage Vac ≥200 Vac/mil ASTM D149
Volume Impedance ohm-cm 6.0 x109 ASTM D257
Flame Rating   V 0 UL 94
THERMAL  
Thermal Conductivity W/m.k 2.0 ASTM D5470

 

 

Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available

 

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

 

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