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Thermal Insulating Pad Selection Guide (0.2W/m.k)

Features and Benefits:


Thermal Conductivity: 0.20W/m.k
High compressible closed-cell silicone foam
Thermal insulating and low compressure Set   
Typical Properties of Thermal Insulating Pad Materials
Properties Units TCP20 Series Test Method
Material --- Silicone Foam ---
Color --- Gray Visual
Cellular structure --- Closed ---
Density g/cm3 0.25 ~ 0.8(+/-0.1) ASTM D792
Hardness Shore C 20~45 (+/-5) ASTM-D2240
Tensile Strength 'Mpa ≥0.4 ASTM D412
Elongation % ≥200 ASTM D412
ELECTRICAL  
Volume Resistivity Ω.cm 1.5×1015 ASTM D149
Dielectric Strength KV/mm ≥15 ASTM-D149
Flame Rating   V 0 UL 94
THERMAL  
Thermal Conductivity W/m.k 0.2 ASTM D5470

Note: "D" suffix: one side tacky and non-tacky on the other side 
      "A1" suffix: Additional adhesive on one side, "A2" suffix: Additional adhesive on both sides
      "M" suffix: Fiberglass reinforcement in the middle layer for all the size if required
      "F" suffix: Fiberglass reinforcement on top or bottom layer
      Standard sheet: 200x400mm, 300x300mm, Custom configuration Available

Premium Thermal Conductive Pad Selection Guide (35,50W/m.k)

Features and Benefits:

◇ 35 and 50 W/mk Outstanding Thermal Conductivity
◇ Carbon Fiber Filled,High Stability and Suitable For Extreme Enviroment
◇ Non- tacky and good rebound for easy applicaiton

Typical Properties of Premium Thermal Pad
Properties Units AL20 AL50 Test Method
Construction & Composition --- Carbon Loaded Silicone Carbon Loaded Silicone ---
Color --- Black Black Visual
Thickness mm 0.50 to 3.0 0.30 to 3.0 ---
Thickness Tolerance   +/-0.02mm +/-0.02mm ---
Hardness (Shore 00) 20 50 ASTM D2240
Density(g/cm) --- 2.4 2.4 ASTM D792
Continuous Use Temp  200 EN344
Breakdown Voltage (AC kV/mm) <0.1 <0.1 ASTM D149
Withstand Voltage (AC kV/mm) <0.1 <0.1 ASTM D149
Volume Impedance (ohm-cm) <500 <500 ASTM D257
Flame Rating   V 0 V 0 UL 94
Specific Heat Capacity --- 0.87 J/g-k 0.87 J/g-k ASTM D5470
Thermal Mass --- 2088 kj/m3-k 2088 kj/m3-k ASTM D5470
Thermal Conductivity W/m.k 35 50 ASTM D5470 
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    Widely Used Thermal Conductive Pad Selection Guide (1.0~7.5 /m.k)

    Features and Benefits:

    ◇All thermal conductive pad/gap pad are used to fill in air gaps between heat-generating electronic component and heatsinks,metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high compliance.

    ◇All our thermal pad series materials is very cost-effective materials which is made through advanced manufacturing process and with meeting the requirement of UL 94 V0 , RoHs and Reach compliance.

    Typical Application

    - Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
    - ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
    - Cooling or thermal Module, in all applications where a metal housing is used as heatsink.

    Typical Properties of 1.0-7.5W/m.k Thermal PadTypical Properties of  1.0-7.5W/m.k Thermal Gap Pad
    Properties Units TCP100 TCP150 TCP200 TCP300 TCP500 TCP600 TCP750 TCP110U
    Color --- Gray Black Dark Gray Blue Pink~Violet Light Blue Violet pink/white
    Reinforcement Carrier --- --- --- --- --- --- --- --- Fiberglass
    Thickness Range mm 0.25~15 0.25~15 0.25~15 0.25~15 0.25~15 0.3~10 1.0~10 0.5~10
    natural tacky 2 2 2 2 2 2 2 2 1
    Hardness Shore C 25,35 15,25,35 15,25,35 25,35 30 30 50 5, 15
    Density g/cc 1.8 2.2 2.4 2.6 3 3.6 3.8 2.0
    Continuous Use Temp -40 to 200
    ELECTRICAL  
    Breakdown Voltage Kv/mm ≥9 ≥9 ≥9 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0
    Volume Impedance ohm-cm ≥4x1012 ≥5x1012 ≥3.6x1013 ≥1.1X1014 ≥1.1X10 14 ≥6.5X1010 ≥6.5x1010 ≥6.2X1015
    Dielectric Constant 1MHz 5.27 5.2 6 6.8 6.6 6.5 6.8 5.5
    Flame Rating --- V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
    THERMAL  
    Thermal Conductivity W/m.k 1.0 1.5 2.0 3.0 5.0 6.0 7.5 1.1

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