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Full Range Of Thermal Conductive Putty/Gel

 

Products Features:


3.0 W/mk Thermal Conductivity,Good Thixotropism
Soft and ultra high compressibility for low stress applications
Higher viscosity compound than grease, it eliminates the bleed, separation,pump-out & dirtly other parts usually associated with grease.
Silicone-Free Thermal Pad

Typical Applications Include:

 

--Between heat-generation Conponment and and heatsink.
--Automotive engine control, Graphices Cards, Telecom device.
--Wireless Hub,Military equipment, power supply.
--Entire large panel PCB Cooling
--Any high compression low stess application
 

Typical Properties of This Materials:

 

Typical Properties of Thermal Conductive Putty/Gel
Properties Units TCP300P TCP300G Test Method
Construction & Composition --- White or Light Blue White or Light Blue ---
Color --- Black Black Visual
Min. BondlineThickness mm NA 0.1 ---
Thickness mm 1.0 to 5.0 NA ---
Density (g/cm) 2.88 2.88 ASTM D792
Hardness Shore 00 5 NA ASTM D2240
Viscosity @0.5rpm ≤100 ≤100 ASTM D149
Temperature Range -40 to 200 -40 to 200 EN344
Volume Impedance (ohm-cm) 5 x1014 1 x1013 ASTM D150
Flame Rating   V 0 V 0 UL 94
Thermal Conductivity W/m.k 3.0 3.0 ASTM D5470
 

 

 

 

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

 

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