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TCP750 7.5W/m.k Heat Conductive Silicon Thermal Heatsink Pad

Products Features:

◇7.5 W/mk High Thermal Conductivity
◇Low Thermal Resistance at Low Pressure
◇Naturally tacky for easy applicaiton

7.5W/m.k Heat Conductive Silicon Thermal Heatsink Pad

Typical Applications Include:

--Between heat-generation Conponment and and heatsink
--Automotive engine control, Graphices Cards, Telecom device.
--Wireless Hub,Military equipment, power supply
--Cooling Module, Thermal module
--Server S-RAMs,BGA packages

Typical Properties of This Materials:

Typical Properties of TCP750 Silicone Thermal Pad
Properties	Units	TCP750	Test Method
Material	---	Silicone	---
Color	---	Orange	Visual
Thickness Range	mm	1.0 to 15.0	---
Natural tacky (1- or 2-sided)	g/cm3	2	---
Hardness	Shore C	50	ASTM-D2240
Density	g/cc	3.9(+/-0.1)	ASTM D792
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥6	ASTM D149
Volume Impedance	(ohm-cm)	≥6.5x10¹⁰	ASTM D257
Dielectric Constant	1MHz	6.8	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	7.5	ASTM D5470

Configurations Available:

Sheet size:200 x 400mm, 350x350mm , individual parts available

Part No. Code:

Suffix: Different Options For thermal Pad as below

“A1” suffix: One side additional adhesive such as 3M 467, 3M9448

“A2” suffix: Two sides additional adhesive such as 3M 467, 3M9448

“NA” suffix: Natural tacky

"D" suffix: one side tacky and non-tacky on the other side

"M" suffix: Fiberglass reinforcement in the middle layer

"F" suffix: Fiberglass reinforcement on top or bottom layer

Check List of Reliability Test Report for TCP600 is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

INSTANT TURNKEY QUOTE

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Next：TCP200 Thermal Silicon Gap Insulation Pad For Heat Sink

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Thermal Products Center

PROTOTYPING

TCP750 7.5W/m.k Heat Conductive Silicon Thermal Heatsink Pad

Products Features:

Typical Applications Include:

Typical Properties of This Materials:

More than 1,000+ big brands trust us every day because we deliver great products. Here's why they trust us and
keep coming back.

Contact Us

Thermal Products Center

PROTOTYPING

TCP750 7.5W/m.k Heat Conductive Silicon Thermal Heatsink Pad

Products Features:

Typical Applications Include:

Typical Properties of This Materials:

More than 1,000+ big brands trust us every day because we deliver great products. Here's why they trust us and keep coming back.

Contact Us

More than 1,000+ big brands trust us every day because we deliver great products. Here's why they trust us and
keep coming back.