TCG150 Thermal Conductive Grease/Paste

Products Features:

◇1.5 W/mk Thermal Conductivity, Good Thixotropism
◇Soft and ultra high compressibility for low stress applications
◇Higher viscosity compound than grease, it eliminates the bleed,
◇separation,pump-out & dirtly other parts usually associated with grease

 

Products Applications:

 

Smart TV stick/USB, Dongle
Automotive engine control, Graphices Cards, Telecom device.
Ideal applications for various mechnical gap tolerances for different heating-generation componment on the PCB
Be used by screen print, syringe, high volume of automated dispense
 

Typical Properties of This Material Type:

Typical Properties of TCG150 Silicone Thermal Grease
Properties	Units	TCG150		Test Method
Composition	---	Silicone		---
Color	---	White		Visual
Viscosity	mPa·s at 0.3rpm	45000		---
Density	g/cc	2.6		ASTM E595
Continuous Use Temp	℃	-60 to 160		EN344
THERMAL
Thermal Resistance@50psi	℃-in2/W	0.021		ASTM D5470
Thermal Conductivity	W/m.k	1.5		ASTM D5470
Shelf Life	2 Years from the date of manufacture at 25℃

Thermal paste easily fills voids between heat sources and heat sinks. By displacing the air from these nooks-and-crannies, a lower thermal resistance is achieved. Notably, the thermal paste material can be applied only where you need it, thereby minimizing waste. The materials can also be reworked because they do not adhere to substrates. The low hardness of Sinoguide’s Gap Filler products minimizes stress on delicate electronic components.