Flexible Thermal Conductive Materials and LED Cooling

Thermal Interface Materials are installed between a heat-generating device and a heat sink or chassis to facilitate heat transfer.

Thermal management starts with the circuit board and electronics package

• Various thermal management approaches include:

– Board-level attachment (through-hole vs. surface mounted)

– Heat sinks

– Metal base plates (e.g. copper, aluminum)

– Constant-current power supplies

– Fans

• Heat is generated on the underside of the chip and travels through a metal block, known as a “slug”, to solder points on the circuit board, and eventually to a heat sink where it is dissipated.

• The selection and use of materials for attachment/assembly are vital

• Thermal Interface Materials (TIMs) range from thermally conductive adhesives to die cut pads that are electrically isolating, as well as thermally conductive

Considerations of Thermal Materials

• Operating temperature
• Dielectric strength
• Bond strength
• Surface wet-out
• Shock performance
• Packaging constraints
• Airflow
• Surface flatness (substrate, heat sink)
• Shape/type of metal used for heat sink
• Applied mounting pressure
• Thickness of the interface and contact area
• Production requirements and part size

Flexible Pads, Tapes, Films