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Select the right thermal interface materials products for your thermal management projects

Select the right thermal interface materials products for your thermal management projects; SinoGuide TIMs minimize the extreme stresses to components and eliminate the air-gaps to reduce the thermal resistance, as well as high conformability reduces interfacial resistance!

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Flexible Thermal Conductive Materials and LED Cooling

Writer: admin;   Source: Sinoguide;   Date:2017-04-25

Thermal Interface Materials are installed between a heat-generating device and a heat sink

Thermal Interface Materials are installed between a heat-generating device and a heat sink or chassis to facilitate heat transfer.

• Die-Cut Pads
• Tight dimensional control
• Range of materials – Polymer, metal matrix, carbon/carbon composite
• Can include adhesive pads Liquids
• Fills gaps more completely
• Range of materials: – Grease, silicone, epoxy
• No mechanical stress
• Some require curing

 
Thermal management starts with the circuit board and electronics package

Thermal management starts with the circuit board and electronics package

• Various thermal management approaches include:
– Board-level attachment (through-hole vs. surface mounted)
– Heat sinks
– Metal base plates (e.g. copper, aluminum)
– Constant-current power supplies
– Fans
• Heat is generated on the underside of the chip and travels through a metal block, known as a “slug”, to solder points on the circuit board, and eventually to a heat sink where it is dissipated.
• The selection and use of materials for attachment/assembly are vital
Thermal Interface Materials (TIMs) range from thermally conductive adhesives to die cut pads that are electrically isolating, as well as thermally conductive

Considerations of Thermal Materials

  • Operating temperature
  • Dielectric strength
  • Bond strength
  • Surface wet-out
  • Shock performance
  • Packaging constraints
  • Airflow
  • Surface flatness (substrate, heat sink)
  • Shape/type of metal used for heat sink
  • Applied mounting pressure
  • Thickness of the interface and contact area
  • Production requirements and part size

Flexible Pads, Tapes, Films

• Easily die-cut to complex shapes
• Excellent high temperature, abrasion, and chemical resistance
• High or low conductivity
• Can be coated with an adhesive on one or both sides
• Formulated to achieve specified performance values in terms of dielectric strength, thermal conductivity, and thermal impedance
• No clean-up or cure time
• Dispensing machinery not required
• Smooth surfaces
• Can be pressure-sensitive

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Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
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