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PROTOTYPING
We can prototype new designs at incredible speed thanks to our highly skilled design engineers, harnessing our global expertise and delivering via our local teams.
We can prototype new designs at incredible speed thanks to our highly skilled design engineers, harnessing our global expertise and delivering via our local teams.
Features and Benefits
-All of our Thermal Conductive Adhesive Tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical fixing for assembly
-Double-sided, pressure sensitive adhesive tape
-Electrically insulating
Typical Application:
- Mount heat sink/spreader onto drive process(BGA)/power converter or Motor control PCB
- In all applications where a metal/plastic housing is used as heatsink without screw or clip mounting and hot-melt glue
| TYPICAL PROPERTIES OF TCT120 | ||
| PROPERTY | METRIC VALUE | TEST METHOD |
| Color | White | Visual |
| Thickness (mm) | 0.15; 0.20; 0.25;0.50 | ---- |
| Adhesive Type | Acrylic Polymer | ---- |
| Carrier | w or w/o Fiberglass | ---- |
| Hardness (Shore A) | 40 | ASTM D2240 |
| Density (g/cm2) | 1.3 | ASTM D792 |
| Tensile Strength (lbs/in ) | 180 | ASTM E1269 |
| Continuous Use Temp (℃) | -40 ~ 150(short term) 90(long term) | EN344 |
| ELECTRICAL | ||
| Dielectric Breakdown Voltage (Vac) | ≥3 kVac/m | ASTM D149 |
| Dielectric Constant (1MHz) | 5 | ASTM D150 |
| Volume Impedance (ohm-cm) | 1 x1013 | ASTM D257 |
| THERMAL | ||
| Thermal Conductivity (W/m.k) | 1.2 |
ASTM D5470 |
Product Photos:
Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
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Longgang district, Shenzhen, P.R.China
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