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Pre-cured Thermal Putty Pad

Product Presentation

 

Products Features:


6.00 W/mk high thermal conductivity
Premium Thermal Pad, Low Thermal Resistance
Ultra conformability for irregular gapping applications
Silicone-Free Thermal Pad

Typical Applications Include:

 

--Between heat-generation Conponment and and heatsink.
--High-end Set Top Box, Graphices Cards, Telecom device.
--Wireless communication hardware
--Cooling Module, Thermal module.
--Server S-RAMs, BGA packages
 

Typical Properties of This Materials:

 

Typical Properties of TCP600-PTY
Properties Units TCSF200 Series Test Method
Material --- Silicone ---
Color --- Lt. Grey Visual
Standard Form --- Mud Visual
Thickness mm 1.0~4.0 ---
Hardness Shore C 15 ASTM D2240
Density g/cc 3.4 ASTM D792
Volatilization Rate @200°C/24H % 0.15% ---
Young's Modulus PSI 213.194 ---
Continuous Use Temp -40 to 200 EN344
ELECTRICAL  
Breakdown Voltage KV 5 ASTM D149
Dielectric Constant 1MHz 5 ASTM D150
Volume Impedance ohm-cm 1.0 x1013 ASTM D257
Flame Rating --- V 0 ASTM D150
THERMAL  
Thermal Resistance
1.5mm@3psi pressure
℃-in²/W 0.34 ASTM D5470
Thermal Conductivity W/m.k 6.0 ASTM D5470

 

 

Configurations Available:

Sheet size:200 x 400mm, 350x350mm , die-cut parts available

 

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

 

 

 

INSTANT TURNKEY QUOTE

 

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