Thermal Gap Filler Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. SinoGuide Thermal Gap Filler Pad is very conformable, filled silicone rubber material and has 1.7-7.5 w/m.k conductivity grades; it is easy to fill in air gaps between PC board and heat sinks or a metal chassis. Our Thermal Gap Filler Pad is naturally tacky, requiring no adhesive coating to inhabit thermal performance. It can also be with specific coating becoming single side tacky to allow easy material handling and installation.

Features and Benefits Typical Applications
High thermal conductivity
Nature tacky or no sticky on carrier side
Cooling components to chassis,frame,or other mating components
RoHs Compliance
Memory Modules
Home and small office network equipment
Mass storage devices
Automotive electronics
Telecommunication hardware
LED solid state lighting
Power electronics
LCD and PDP flat Panel
Set top boxes
Audio and video component
IT infrastructure
 

 Configurations Available:

 Sheet size:200 x 400mm, 350x350mm , individual parts available

Part No. Code:

Suffix: Different Options For thermal Pad as below

"A1" suffix: One side additional adhesive such as 3M 467, 3M9448

"A2" suffix: Two sides additional adhesive such as 3M 467, 3M9448

"NA" suffix: Natural tacky

"D" suffix: one side tacky and non-tacky on the other side

"M" suffix: Fiberglass reinforcement in the middle layer

"F" suffix: Fiberglass reinforcement on top or bottom layer

Check List of Reliability Test Report for TCP450 is available after your request