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Gap Pads Materials for Efficient Heat Transfer

Cheap Gap Pad Selection Guide (1~8.0W/m.k)

Exceptionally soft, highly compressible gap filler
SinoGuide TCP series Gap Pad is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 1-8.0 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.

Features and Benefits:

Thermal Conductivity: 1~8.0W/m.k
Fiberglass Reinforcement or not
Naturally tacky on one side or two side for easy assembly
Electrically insulating
Resist to puncture, shear and tear

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    Widely Used Thermal Gap Pads Selection Guide (1.0~8.0 /m.k)

    Highly compliant Gap Pads material that is ideal for fragile component leads


    Typical Application

    - Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
    - ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
    - Cooling or thermal Module, in all applications where a metal housing is used as heatsink.

    Typical Properties of 1.0-7.5W/m.k Thermal Pad/SheetTypical Properties of  1.0-8.0W/m.k Gap Pads
    Properties Units TCP100 TCP150 TCP200 TCP300 TCP500 TCP600 TCP800 TCP110U
    Color --- Gray Black Dark Gray Blue Pink~Violet Light Blue Grey pink/white
    Reinforcement Carrier --- --- --- --- --- --- --- --- Fiberglass
    Thickness Range mm 0.25~15 0.25~15 0.25~15 0.25~15 0.25~15 0.3~10 0.5~5.0 0.5~10
    natural tacky 2 2 2 2 2 2 2 2 1
    Hardness Shore C 25,35 15,25,35 15,25,35 25,35 30 30 60 5, 15
    Density g/cc 1.8 2.2 2.4 2.6 3 3.6 3.2 2.0
    Continuous Use Temp -40 to 200
    Breakdown Voltage Kv/mm ≥9 ≥9 ≥9 ≥6.0 ≥6.0 ≥6.0 ≥6.8 ≥6.0
    Volume Impedance ohm-cm ≥4x1012 ≥5x1012 ≥3.6x1013 ≥1.1X1014 ≥1.1X10 14 ≥6.5X1010 ≥4.9x1010 ≥6.2X1015
    Dielectric Constant 1MHz 5.27 5.2 6 6.8 6.6 6.5 6.8 5.5
    Flame Rating --- V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
    Thermal Conductivity W/m.k 1.0 1.5 2.0 3.0 5.0 6.0 8.0 1.1

Contact SinoGuide for Cheap Thermal Gap Pads

SinoGuide have developed a comprehensive range of choices for thermal interface materials which include gap pads, thermal grease, thermally conductive gap filler, thermal conductive insulators and phase change materials, which satisfy the requirement of heat dissipation well in an extensive variety of applications, as well as widely applied to electromechanical, automotive, telecom and military industries.


Contact Us for further assistance with gap pads, including thermal gap filler pads, thermally insulating foam, heat conductive pads, thermal conductive pads, and thermal interface pads.

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