Gap Pads Materials for Efficient Heat Transfer

Cheap Gap Pad Selection Guide (1~8.0W/m.k)

Exceptionally soft, highly compressible gap filler
SinoGuide TCP series Silicone Gap Pad is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 1-8.0 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.

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Widely Used Thermal Gap Pads Selection Guide (1.0~8.0 /m.k)

Highly compliant Silicone Gap Pads material that is ideal for fragile component leads

 

Typical Application

- Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
- ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
- Cooling or thermal Module, in all applications where a metal housing is used as heatsink.




Typical Properties of  1.0-8.0W/m.k Gap Pads
Properties	Units	TCP100	TCP150	TCP200	TCP300	TCP500	TCP600	TCP800	TCP110U
Color	---	Gray	Black	Dark Gray	Blue	Pink~Violet	Light Blue	Grey	pink/white
Reinforcement Carrier	---	---	---	---	---	---	---	---	Fiberglass
Thickness Range	mm	0.25~15	0.25~15	0.25~15	0.25~15	0.25~15	0.3~10	0.5~5.0	0.5~10
natural tacky	2	2	2	2	2	2	2	2	1
Hardness	Shore C	25,35	15,25,35	15,25,35	25,35	30	30	60	5, 15
Density	g/cc	1.8	2.2	2.4	2.6	3	3.6	3.2	2.0
Continuous Use Temp	℃	-40 to 200
ELECTRICAL
Breakdown Voltage	Kv/mm	≥9	≥9	≥9	≥6.0	≥6.0	≥6.0	≥6.8	≥6.0
Volume Impedance	ohm-cm	≥4x1012	≥5x1012	≥3.6x1013	≥1.1X1014	≥1.1X10 14	≥6.5X1010	≥4.9x1010	≥6.2X1015
Dielectric Constant	1MHz	5.27	5.2	6	6.8	6.6	6.5	6.8	5.5
Flame Rating	---	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
THERMAL
Thermal Conductivity	W/m.k	1.0	1.5	2.0	3.0	5.0	6.0	8.0	1.1

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Contact SinoGuide for Cheap Thermal Gap Pads

SinoGuide have developed a comprehensive range of choices for thermal interface materials which include gap pads, thermal grease, thermally conductive gap filler, thermal conductive insulators and phase change materials, which satisfy the requirement of heat dissipation well in an extensive variety of applications, as well as widely applied to electromechanical, automotive, telecom and military industries.

 

Contact Us for further assistance with gap pads, including thermal gap filler pads, thermally insulating foam, heat conductive pads, thermal conductive pads, and thermal interface pads.